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LEPA EXllusion 240 All-in-One Refillable CPU Cooler Review

LEPA and its new EXllusion 240 All-In-One CPU cooler touts 400 watts of cooling ability, a patented copper cooling plate, a larger volume of liquid in the block itself, and a "silent" pump, all with a refillable design. Overall it has the look of a quality built AIO, but is the EXllusion worth 120 of your hard earned dollars?


LEPA is probably a more familiar name to PSU fans, but rest assured the brand wants to make its way into the CPU cooler market as well. We've looked at some LEPA coolers in the past including the LV12 air cooler and more recently we looked at the AquaChanger 240 AIO. Both of these coolers provided average cooling performance but never challenged the top performers. Hoping to change this unfortunate fact, LEPA has sent us their newest AIO cooler dubbed the EXllusion 240.

The EXllusion 240 uses a refillable design which allows for more flexible configurations along with fans that have dual convex blades allowing smoother airflow. All together the EXllusion 240 looks like an interesting AIO with some nice features but will it perform well enough to get your attention this holiday shopping season?

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System Setup

Today's review takes place on our fourth generation [H]ard platform. The test bed consists of the ASUS Z87-Deluxe motherboard, eight gigabytes of Corsair 1600 MHz DDR3 RAM and the Intel Core i7-4770K.

Test Methods


The biggest change you will notice is the removal of hardware testing. In recent years, Intel has shifted its methods of testing to software based and so we find it acceptable to do the same.


Once again we have an integrated GPU in our processor which alleviates the need for a discrete one. With the removal of a discrete GPU comes the advantage of not having an additional variable to account for.

The iGPU will not create any anomalies in our testing as long as we practice consistent testing methods.


Corsair was kind enough to provide us with its Carbide series chassis. It provides excellent airflow and interior space and is a good reflection on current case design.

Thermal Paste

Noctua's NT-H1 thermal paste was selected as the thermal interface material (TIM) of choice for a few key reasons. The thermal paste has been shown to provide excellent thermal conductivity allowing the heat sinks to better do its job. There is no observed curing time. That is, performance does not get any better over time. Any curing time could have introduced variables into the equation causing at best dubious results and at worst unreliable ones.


Ambient temperature will be kept at 25C for the duration of the tests and measured with a MicroTemp EXP non-contact infrared thermometer and cross referenced with the Sperry Digital 4 Point thermometer. Any variance greater then 0.2C will halt the testing until temperatures return within spec for fifteen minutes.


Idle temperatures will be recorded after a twenty minute period of inactivity. Any fluctuation during the last sixty seconds will reset the timer for an additional five minutes.


Load temperatures will be recorded after a twenty minute period for air cooled systems, and thirty minutes for liquid cooled systems, at 100% load. To obtain this load we will be using AIDA64 Extreme Edition v3.00.2500. This places an even greater load on the CPU than before and includes some benefits. Because the load is so extreme we see the temperature vary wildly from 72C to 86C in some instances. To get an accurate reading we will utilize AIDA64’s ability to average the temperature over time. Given twenty/thirty minutes at 100% load we arrive at a temperature that accurately represents our heatsink’s performance.


Sound levels will be measured with a Reliability Direct AR824 sound meter from a distance of four feet away. With everything turned off and the room completely silent the meter registered a sound level of 38dB(A). This is a very quiet room where a simple pin drop could be heard. All sound measurements are recorded in the very late evening to further reduce any ambient noise.