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Monday October 30, 2006

IBMs Next-Gen Cooling Techniques

IBM has demonstrated two new cooling techniques the greatly improve on today’s processor cooling. We’ve talked about the “high thermal conductivity interface technology” here several times in the past, the new method of applying thermal paste supposedly gives a twofold improvement in heat removal over current methods. The other process is a direct die water cooling process. Thanks to Daylon Walton for the linkage.

As chip performance continues to progress according to Moore's Law, efficient chip cooling has become one of the most vexing problems for designers of electronic products. The IBM technique outlined today is one of several being explored by scientists from the IBM Zurich Research Laboratory to address the issue.